Key Points for Cutting Wafer Biscuits
1. Key Cutting Techniques
Temperature Control: The texture of wafer biscuits is significantly affected by temperature. If the temperature is too high, the filling may become too soft and easily leak out; if the temperature is too low, the biscuits may become too brittle and easily break. Therefore, before cutting, it is best to keep the wafer biscuits at a suitable temperature, generally room temperature. Wafer biscuits that need to be refrigerated can be removed from the biscuit prior to cutting and allowed to warm slightly before cutting.
Cutting Speed and Pressure: Whether using a knife or cutting equipment, cutting speed and pressure must be properly controlled. Cutting too fast may cause the biscuit to break, especially when cutting through a harder filling. Cutting too slowly may cause the filling to squeeze out under pressure. Excessive pressure can also cause the biscuit to break and leak out, while too little pressure may prevent the biscuit from being cut smoothly. In practice, cutting speed and pressure should be adjusted based on the specific conditions of the wafer biscuits (such as thickness, texture, and filling type).Cutting Direction: Cutting direction is also important for multi-layered wafer biscuits. Generally speaking, cutting perpendicular to the biscuit’s layer structure makes it easier to maintain a neat cut. Cutting along the biscuit’s layer structure may cause the filling to separate or the biscuit layers to fall apart, affecting the product’s appearance and taste.
2. Post-Cutting Handling
Cleaning: After cutting wafer biscuits, some biscuit crumbs will be produced. These crumbs must be cleaned promptly to prevent them from interfering with the next round of cutting or contaminating the product. The cutting tool can be wiped with a clean, damp cloth to remove any remaining biscuit crumbs and fillings. The cutting equipment, including the conveyor belt, blades, and machine body, requires regular deep cleaning to ensure proper hygiene and proper operation.
Packaging: Cut wafer biscuits should be packaged promptly to preserve their freshness and taste. Moisture- and oxygen-resistant packaging materials, such as plastic film or aluminum foil, are typically used. During packaging, care should be taken to avoid squeezing the biscuits to prevent breakage and deformation of the filling.
Cheersonic offers many ultrasonic slicing models, both inline and offline applications, with production speeds of 80 to 1,500 cakes or pies per hour.
Cheersonic’ latest offline introductions include ultrasonic cutting with or without divider inserts between each slice. This improves the quality of the cut and makes for a much better product presentation for the customer. In addition, robotic arm improves the speed, efficiency, and accuracy of the cutting process, producing professional looking products every time.
Chinese Website: Cheersonic Provides Professional Ultrasonic Cutting Solutions
