Key Points for Cutting Wafer Biscuits
Key Points for Cutting Wafer Biscuits 1. Key Cutting Techniques Temperature Control: The texture of wafer biscuits is significantly affected by temperature. If the temperature is too high, the filling may become too soft and easily leak out; if the temperature is too low, the biscuits may become too brittle and easily break. Therefore, before cutting, it is best to keep the wafer biscuits at a suitable temperature, generally room [...]

